Next Generation Power Electronics Control: A distributed control platform for rapid control prototyping operating at high temperature and offering unique safety features

The goal of the project is the development of a self-learning controler to meet the high demands on the dynamics of the regulated output voltage of a DC/DC converter.

The goal of this project is to create a reliable hermetic wafer-level packaging for MEMS sensors in order to

• Increase the life-time of the sensors in consumer / automotive applications
• Further reduce the cost and foot-print of the sensors
• Facilitate the development of novel sensors in wafer-level 

The goal of the project is to study die bond processes and material stack-up to

• Reduce temperature induced stress
• Increase process stability