The Microsystems Research Division aims to develop beyond state-of-the-art technologies for novel micro-electromechanical systems (MEMS) and MEMS devices. In close collaboration with our industrial and scientific partners we develop cutting-edge technology from design and proof-of-concept to product prototypes.

MAIN AREAS OF RESEARCH

• Piezoelectric MEMS: Full development of next generation piezo-based MEMS sensors and actuators (such as RF-MEMS, MOEMS, acoustic MEMS) via finite element modeling, design, microfabrication and advanced testing
• Thin Films: Deposition of high-quality thin film materials including piezoelectric, dielectric and metallic materials, as well as development of novel thin films, advanced characterization methods and application testing of thin films in device structures
• Integrated Photonics: Full development from concept to prototyping of on-chip photonics-based sensors using innovative integrated photonics, meta-optics and integrated opto-microfluidics technologies for applications in remote sensing (LiDAR), 3D imaging, environmental monitoring and telecommunications
• Magnetic Microsystems: Design and fabrication of magnetic sensors (AMR, MEMS integration, …), computational magnetism, magnetic position systems, prototyping
• Advanced Microfabrication of MEMS sensors and actuators at SAL cleanroom facilities
• Emerging technologies: Exploring emerging materials and developing new MEMS device concepts for future applications

RESEARCH COMPETENCIES

• Design, modeling and co-simulation of MEMS devices: Based on our customer’s requirements, we design and optimize novel microsystems through various co-simulation techniques.
• Conception and prototyping of microsystems: Years of experience in the field of nano- and microtechnology have enabled us to develop unique and robust process flows for the microfabrication of MEMS devices. With more than 1400 square meters of state-of-the art SAL cleanroom facilities at our disposal, and in close collaboration with our academic and industrial partners, we are able to fabricate and validate complex devices on substrates from single chips up to 200 mm wafers, thus meeting our customers specific MEMS development requirements.
• Characterization of materials, sensors and actuators: Utilizing our broad range of testing and inspection equipment, we offer various services for characterization of thin film materials and MEMS devices.

In addition to these competences and our long-standing experience in MEMS, the Microsystems Division also relies on cross-border and interdisciplinary skills. These capabilities enable the team to push the boundaries of current technologies, promoting innovative and ground-breaking ideas in various directions and for diverse applications, with a strong focus on partners’ and markets’ interests.