Packaging & Multiphysics

Research Foci

• High-fidelity multi-physics component modeling through experimental characterization and measurements allows the optimization of the system towards high-power density and integration of enhanced functionalities.
• Accurate multi-physics modelling of components and subsystems which are not available from manufacturers and are normally not completely considered in the design of PE systems, e.g., related to high-frequency model and parasitics, packaging details, thermal behavior, material properties, etc..
• A more accurate design and simulation of PE components and systems allows optimization of the functional, mechanical and thermal performance of the power converter towards 3D integration and high-power density.
• Dependable Power Electronics: The inclusion of above mentioned detailed component models through “intelligence” and enhanced functionalities aims at more dependable PE systems.

Research competencies

• Design and optimization of system-level integrated power electronics, modules and systems with enhanced functionalities going beyond state-of-the-art by e.g., multi-domain design and multi-physics simulations, 3D system integration, advanced cooling solutions, active and passive component embedding, advanced gate driving and diagnostic functions.

Applications

• Tiny Power Box 1 & 2: In the “Tiny Power Box” projects, the focus is on optimizing the power density of built-in chargers in electric cars, so-called onboard chargers. The aim is to reduce weight, save components and space while at the same time increase power density, achieve highest efficiency for charging and the vehicle-to-grid case, as well as increase environmental compatibility.