Microsystems

We advance integrated photonic technologies for high-performance communication, sensing, Co-Packaged Optics (CPO), and quantum applications.

Our unit provides end-to-end capabilities including design, modeling, fabrication, and characterization of photonic devices. We operate across key technology platforms such as thin-film lithium niobate (TFLN), aluminum nitride (AlN), meta-optics, mid-IR/III-V materials, and nonlinear optics. Using our state-of-the-art cleanroom infrastructure, we prototype devices such as photonic integrated circuits (PICs), meta-optic 3D imaging systems, and quantum photonic components. These technologies enable solutions for telecommunications, automotive, consumer electronics, and emerging quantum and sensing applications.