Piezoelectric Microsystem Technologies

We cover the full development chain from device design to fabrication and characterization of piezoelectric MEMS.

Design & Simulation:

• Application-driven design of piezoelectric MEMS devices
• Definition of material stacks and process concepts
• Multiphysics simulation (acoustic, electrical, optical) at device, package, and system level
• Analytical, compact, and behavioral modeling (incl. nonlinear effects)
• Machine learning-assisted design optimization and system co-design

Fabrication:

• Process development on 200 mm Si and SOI wafers
• Thin-film deposition and structuring of AlN, AlScN, and PZT
• Electrode and passivation layer integration
• Silicon micromachining (front- and backside etching)
• Wafer-level vacuum packaging
• Transfer from proof-of-concept to scalable processes

Characterization & Testing:

• Design of test structures and process control monitors
• Acoustic characterization (anechoic chamber, acoustic tanks, Verasonics)
• Optical and mechanical characterization (e.g. LDV, digital holography)
• Electrical testing (impedance and network analysis up to GHz range)