ALL2GaN

The project ALL2GaN enables an important step towards European technological sovereignty. ALL2GaN is based on a classical work package structure with 7 work packages. The work package structure follows the overall value chain and includes Technology (WP1-WP3), Integration & Packaging (WP4), Reliability (WP5) and Use Cases (WP6).

• WP1: GaN power devices and IC’s up to 100V and substrate topics
• WP2: Novel solutions for lateral GaN devices and integrated circuits (≥650V)
• WP3: Affordable high performance RF GaN with novel integration
• WP4: Integration and packaging of GaN devices
• WP5: Reliability from Components to Systems
• WP6: Use Cases for greener and smarter applications

This project structure thoroughly supports the overall ALL2GaN goals of increasing the material and energy efficiency of GaN power RF technologies, including all aspects from substrates to systems.

SAL serves as the WP4 Leader for the Integration and Packaging of GaN devices. Within this work package, SAL develops innovative interconnects and packaging solutions (SiP, SiB, SiM) for GaN IC, discrete devices and GaN multi-chip modules. Additionally, SAL will contribute to the "Use case for High-efficiency RF amplifiers for mobile networks" in WP6, where the design, implementation, and characterization of broadband MMIC PA in 8GHz band is planned.