Research Services:

R&D versatile capability etching Tool with wide temperature range heated lower electrode. Proposed for wide band gap materials, glass and ceramics Dry etching. Mechanical clamping for wafers up to 8“ in diameter.

Expertise:

Material etching portfolio:

• Metals
• PZT
• AlN and AlScN (up to 40% Scandium)
• LiNbO
• SiC, SiOC
• GaN, InGaN, AlGaN