OXFORD ICP RIE CL -BASED 418499
Multiple purpose versatile etching tool for WBG materials and metal etching.
R&D versatile capability etching Tool with wide temperature range heated lower electrode. Proposed for wide band gap materials, glass and ceramics Dry etching. Mechanical clamping for wafers up to 8“ in diameter.
Material etching portfolio:
- AlN and AlScN (up to 40% Scandium)
- SiC, SiOC
- GaN, InGaN, AlGaN