Frontend Integrated Circuits & Systems

In the Frontend Integrated Circuits and Systems Research Unit, we focus on A/D and D/A converters, RF and mixed-signal IP, and front-end ICs for communication and sensor systems. The team has in-depth expertise in the design of data converters and integrated sensor solutions for a wide range of applications, such as LiDAR, thermal imaging, and ultrasound imaging. In addition, we focus on RF and mixed-signal design, the development of ASICs, AFE circuits, and FPGA-based prototypes for digitally intensive transceiver architectures and smart sensors, incorporating RFIC (SoC), SiP, and heterogeneous integration technologies.

• SAR-ADC, sigma-delta ADC, flash, and cyclic TDC in ASICs and FPGAs
• RF DAC
• Integrated Matching Networks and Baluns
• Scanning and Sub-Scanning Receivers
• LiDAR applications, ranging from automotive technology to medical imaging, based on ToF and FMCW technology
• ToF image sensors based on SPADs
• AMS-IC design for sensor interfaces such as bolometers, pMUTs, and fully digital MEMS mirrors
• Co-design and co-optimization of photonic IC and RF front-end modules using heterogeneous integration technologies such as System-on-Module (SoM)
• ASIC Design for Quantum Applications