Politur

With the project POLITUR, SAL plans to broaden its horizons in More-than-Moore technologies with a combination of a chemical wet bench and chemical-mechanical polishing systems that will enable SAL to offer high-tech R&D solutions for 3D integration, advanced microelectronic packaging, integrated photonics and quantum technology. The acquisition of a wafer preparation equipment consisting of a chemical wet bench and chemical-mechanical polishing systems (CMP) will enable highly innovative research as well as small batch production in the field of semiconductor processing and microfabrication. High-precision direct wafer bonding (DWB) is one of the core technologies for new areas such as advanced packaging, integrated quantum photonics and telecommunications of the future.