EVG SMART VIEW

SAL Villach

EVG SMART VIEW

The SmartView NT automated bond alignment system for universal alignment offers a proprietary method for micron-level face-to-face wafer-level alignment.

Research Services:

  • Wafer stacking for 3D interconnect, wafer-level packaging and high-volume MEMS devices.
  • Bond pairs are aligned and clamped prior to loading into the bond chamber (for anodic, adhesive and glass frit bonding).
  • Manual or fully automated configurations.
  • Suitable for automated process line in 200 mm and 300 mm configurations.

 

Expertise:

Wafer stacking for 3D interconnect, wafer-level packaging and high-volume MEMS devices.

 

Contact

Heimo Müller

Head of Business Development & Grant Office

heimo.mueller@silicon-austria.com

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