The new Heterogeneous Integration Technologies laboratory includes our R&D equipment for the assembly of microsystems. It enables the assembly of micro components with high placement accuracy and high process flexibility. Besides that, the new lab offers many more possibilities to work on:
- Micro-Dispensing of different media (e.g. solders, sinter pastes, adhesives, filling materials)
- State of the Art Wirebonder
- Typical applications e.g. flipchip bonding, die bond, micro-optical systems assembly
- Research and services in packaging and interconnection technology
