A new research project has been initiated with the goal of advancing microacoustic MEMS devices, reflecting ongoing efforts in technological advancements. Over the next 3.5 years, the project team aims to develop novel piezoelectric thin film configurations, improve the state-of-the-art in semiconductor manufacturing technology and actively develop next generation microacoustic MEMS devices. The focus is on developing new technological solutions for MEMS microspeakers with several potential applications, from earphones to smart glasses.
MUSIC is led by Senior Scientist Annalisa De Pastina from the Research Unit Piezoelectric Microsystem Technologies at SAL. Annalisa is responsible for the development of MEMS with integrated piezoelectric transduction, with a particular focus on microtechnology and design.
Mohssen Moridi, Head of Research Division Microsystems at SAL about the project: “We are glad to work on the development of new technological solutions for piezo MEMS microspeakers together with internationally renowned industry partners. The results of this effective cooperation will have a positive impact on MEMS and integration of advanced piezoelectric thin-film technologies, resulting in various emerging applications.”
Project Consortium: SAL meets industry
At SAL, the two Research Units Piezoelectric Microsystem Technologies and Thin Film Technologies are involved in the project. Besides SAL, the consortium consists of the four renowned industrial partners STMicroelectronics, USound, EV Group and Evatec.
STMicroelectronics (NYSE: STM) is a global semiconductor leader serving customers across the spectrum of electronics applications.
USound is a fast-growing company that develops advanced MEMS speakers for a wide range of audio devices, such as audio glasses, true wireless (TWS) earphones, and over-the-counter (OTC) hearing aids. USound’s CTO Andrea Rusconi Clerici is looking forward to the collaboration: “USound is pleased to be part of this international, innovative project enabling next generation MEMS-based actuator solutions.”
EV Group is a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor market. “The integration of different materials in MEMS devices places high demands on manufacturing technologies. We will leverage our expertise in wafer-level bonding to develop a new integration process with the aim to optimize the performance of next-gen speakers,” explains Bernd Dielacher, Business Development Manager at EV Group.
Evatec is a leading and complete thin film production solutions supplier in its core markets of Advanced Packaging, Power Devices, MEMS, Optoelectronics, Wireless Communication and Photonics. Dino Faralli, Product Marketing Manager on Evatec’s contributions to the project: “The deposition of thin film piezo materials like AlScN and PZT is a core know-how within Evatec. We are ready to contribute to the project with the development of a ‘production-ready’ deposition process for the next generation thin-film mspeakers. Our work will mostly concentrate on the optimization of the residual stress for the Pt/AlScN layer stack.”
About Silicon Austria Labs (SAL)
Silicon Austria Labs GmbH (SAL) was founded in 2018 as a top non-university research center in the field of electronic based systems. At its locations in Graz, Villach and Linz, research is conducted on key technologies in the fields of Microsystems, Sensor Systems, Power Electronics, Intelligent Wireless Systems and Embedded Systems. SAL brings together key players from industry and science and thus valuable expertise and know-how, and conducts cooperative, application-oriented research along the value chain. The aim is to accelerate the value creation process from idea to innovation – with excellent research and economic benefits. Owners are the Republic (50.1%), the Provinces of Styria and Carinthia (10% each), the Province of Upper Austria (4.95%) and the Association for the Electric and Electronics Industry (24.95%).
