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Advanced Packaging Technologies via Novel Sputtering

Advancing 3D and 2.5D wafer-level inte­gra­tion by devel­oping novel PVD tech­nolo­gies and mate­rials for the fabri­ca­tion of TSV inter­posers and hybrid-bonded wafers.

Objectives

  • To develop and eval­uate processes for the fabri­ca­tion of TSVs with medium to high aspect ratios
  • To inves­ti­gate low-temper­a­ture hybrid bonding using novel fabri­ca­tion processes and mate­rials

Expected Results 

  • Re­search and devel­op­ment of low temper­a­ture Hybrid bonding process below <250 °C
  • Demon­stra­tion of Hybrid bond test vehi­cles with novel mate­rials and fabri­ca­tion process
  • Demon­stra­tion of TSV inter­poser with medium to high aspect ratios with novel PVD processes

Contact

Business Development
Ronja Krimm MSc
Business Development HIT
Villach

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