CAPSENS

Wafer-level integration has played a critical role in the development and successful commercialization of MEMS as well as other microelectronics systems. Various wafer-level integration technologies via state-of-the-art wafer bonding, wafer back-end processing, 2D, 2.5D & 3D integration processes have been developed in SAL with a different set of requirements for a variety of applications. In the project “CAPSENS” hermetic triple stack wafer-level bonding for a miniaturized environmental sensor based on the photoacoustic spectroscopy (PAS) is investigated. The bonding strategies for Cap wafer, MEMS wafer and bottom wafer are defined and assessed.

Project Objectives

To create a reliable hermetic wafer-level packaging for MEMS sensors in order to
- increase the lifetime of the sensors in consumer / automotive applications.
- further reduce the cost and foot-print of the sensors.
- facilitate the development of novel sensors in wafer-level.
The selection of bonding and sealing technologies to work under different environmental atmospheres
Microfabrication of the cap wafer
Wafer stacking of 3 wafers under controlled atmosphere

Project facts

Title: WAFER LEVEL HERMETIC CAPPING FOR MEMS SENSING

Program: SAL Cooperative Research (SCR)

Project leader: Ali Roshanghias

Duration: 12/2020 - 10/2021

Your contact person

Dr. Ali Roshanghias

Head of Research Unit | Heterogeneous Integration Technologies

e-mail: contact@silicon-austria.com