Research Services:

• E-beam evaporation system with 4 pockets
• DC and RF sputtering with 3 magnetron cathodes

Expertise:

The UNIVEX900 is an advanced coating system which can perform co-sputtering and e-beam evaporation in the same chamber in the same chamber. This tool is compatible with 8-inch wafers (200 mm) and can be used to deposit many materials such as metals, oxides or nitrides.

Magnetron sputtering:

• Three magnetron sources, housing 100mm targets (indirectly or Directly cooled targets)
• Two source generators: DC (1500 W) and RF (600 W)
• Co-sputtering, reactive sputtering (O2 / N2)
• Bias generator, holder's heating / cooling

E-beam evaporation:

• 4-pocket turret from Ferrotec (EV M-6, 8cc)
• E-beam acceleration voltage: 10 kV
• E-beam gun power: 5 kW
• Crucible-to-Wafer distance: > 90 cm
• PID-controlled deposition rate