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CPO – (Piezoelectric Micromirror for) Optical Switch

To develop an advanced on-chip sensor integrated MEMS mirror and MEMS mirror array for optical switch applications

Objectives

To create a scalable-mirror-count MEMS (MEMS = microelectromechanical systems) mirror array with on-chip precise angle sensors in order to improve:

  • Next generation of MEMS devices in high-density scalable-mirror-count
  • Innovative design, microfabrication, and test capability technologies of MEMS devices with on-chip precise angle sensors

The main challenges are:

  • Fabrication process development for scalable-mirror-count MEMS array with TSV and ASIC
  • Development of proof-of-concept optical cross connects with fabricated chips for polishing the further chip development

Expected Results 

  • Establishment of modeling, design, microfabrication, and test capability for scalable MEMS mirror devices
  • Establishment of foundation of scalable device fabrication technology with TSV and ASIC
  • Establishment of proof-of-concept optical cross connects with fabricated chips for polishing the further chip development

 

 

Who we are looking for

  • Industry / application partners: Datacenter architecture and system integrator
  • Technology or component partners: Fiber optics suppliers
  • Equipment / manufacturing partners: Advanced optical packaging partner, MEMS foundry

Contact

Business Development
Lisa Kainz MA
Business Development Microsystems
Graz

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