To create a scalable-mirror-count MEMS (MEMS = microelectromechanical systems) mirror array with on-chip precise angle sensors in order to improve:
- Next generation of MEMS devices in high-density scalable-mirror-count
- Innovative design, microfabrication, and test capability technologies of MEMS devices with on-chip precise angle sensors
The main challenges are:
- Fabrication process development for scalable-mirror-count MEMS array with TSV and ASIC
- Development of proof-of-concept optical cross connects with fabricated chips for polishing the further chip development