OXFORD ICP RIE BOSCH 418441
SAL Villach
OXFORD ICP RIE BOSCH 418441
Bosch dry etching Tool. 8“ wafers etch with ESC clamping. 6“ and 4” wafers with mechanical clamp configuration.
Research Services:
- Cavities/Cap etching for MEMS applications
- High aspect ratio etching
- Continuous mixed Si etching for shallow (~1um)features
- SiO2 and SiNx etching
Expertise:
The PlasmaPro®100 Cobra is a modular plasma processing etch tool. A large range of options is available to precisely tailor the tool to the customer's requirements. The tool features a small footprint and a semi-automatic loading system. The PlasmaPro®100 Cobra can process a wide range of wafer sizes, from small wafer pieces up to 200 mm (8”) diameter.
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