Research Services:

• Wafer level microfabrication 8” capability
•  Die/chip level microfabrication capability
• Minimal resolutions ≤ 10 µm (Remark: depends on the substrate and the ink type)
• 2.5D (3D) heterogeneous structures (e.g. combination of metal and dielectric)
• Suitable to print over multi-material 3D substrates (Si wafers, polymers, ceramic, etc.)
• Adjustment ejection flow rate (i.e. ejection frequency) is possible by many orders of magnitude

Expertise:

Main Services:

• Selective repair & modification
• Rapid prototyping
• Printing of various nanoparticle-based inks (conductive, dielectric etc.)