Research Services:

• Wafer level microfabrication 8” capability
• Die/chip level microfabrication capability
• Minimal resolutions ≤ 10 µm (Remark: depends on the substrate and the ink type)
• 2.5D (3D) heterogeneous structures (e.g. combination of metal and dielectric)
• Suitable to print over multi-material 3D substrates (Si wafers, polymers, ceramic, etc.)
• Adjustment ejection flow rate (i.e. ejection frequency) is possible by many orders of magnitude
• 5G-Testbed for industrial equipment via wireless connections for experimental performance evaluation and configuration optimization (under real life conditions)
• Research & Development of application protocols, TSN integration and positioning 
• Training & Support from theoretical aspects to roll out and deployment challenges

Expertise:

SAL offers services around Wireless standards.