SAL Linz


5G-Testbed for industrial equipment via wireless connections.

Research Services:

  • Wafer level microfabrication 8” capability
  • Die/chip level microfabrication capability
  • Minimal resolutions ≤ 10 µm (Remark: depends on the substrate and the ink type)
  • 2.5D (3D) heterogeneous structures (e.g. combination of metal and dielectric)
  • Suitable to print over multi-material 3D substrates (Si wafers, polymers, ceramic, etc.)
  • Adjustment ejection flow rate (i.e. ejection frequency) is possible by many orders of magnitude
  • 5G-Testbed for industrial equipment via wireless connections for experimental performance evaluation and configuration optimization (under real life conditions)
  • Research & Development of application protocols, TSN integration and positioning 
  • Training & Support from theoretical aspects to roll out and deployment challenges



SAL offers services around Wireless standards.



Stefan Wimmer

Manager Business Development


Member Area