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Magnetics for CPO

Integrating high-frequency magnetic passives into CPO packages which enables efficient local power conversion, higher power density, and improved power integrity.
Partner Call offen bis: End of 2026
Projekt­start: Q1 2027

Objectives

  • Define power-conversion requirements fitting to CPO: Identify relevant input/output voltages, power levels, switching frequencies, current densities, footprint, efficiency, and thermal constraints for CPO and AI/HPC packages.
  • Develop high-frequency magnetic materials: Optimize thin-film or microfabricated magnetic materials for roughly 10–100 MHz, targeting high saturation flux density, high permeability, and low core loss.
  • Design integrated magnetic passives: Develop micro-inductors, coupled inductors, microtransformers, and EMI chokes suitable for package/interposer integration.
  • Develop fabrication and packaging concepts: Establish wafer-level or package-compatible processes for integrating magnetic cores and windings into interposers, redistribution layers, substrates, or chiplets.
  • Demonstrate and validate a CPO power-in-package prototype: Build and experimentally characterize an integrated demonstrator in terms of efficiency, thermal behavior, EMI, transient response, power density, and reliability.
  • Optimize converter–magnetics co-design: Co-design the magnetic components with IVRs, multiphase converters, resonant converters, and point-of-load architectures to maximize efficiency and power density.

Expected Results 

  • Power-conversion requirements understood, CPO-application identified
  • High-frequency magnetic materials optimized
  • Integrated magnetic passives developed
  • Package-compatible fabrication established
  • Converter–magnetics co-design demonstrated
  • CPO power-in-package prototype validated

 

 

Who we are looking for

  • Hyperscalers / data-center operators
  • AI / networking processor vendors
  • CPO / silicon-photonics vendors
  • Advanced packaging / foundry players
  • Power-management IC companies
  • Telecom / networking equipment manufacturers
  • Automotive HPC vendors / OEMs

Contact

Business Development
Lisa Kainz MA
Business Development Microsystems
Graz
+43 664 88 964 965
lisa.kainz@silicon-austria.com

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