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Massive Parallelization via Spatial Division Multiplexing

Develop fabricable and scaleable concepts and demonstrators for heavily parallelized data transmission using spatial division multiplexing.

Objectives

Unlike high-speed optical data transmission, wide and slow concepts achieve high data transmission rates through extensive parallelization using spatially separated channels, e.g. by means of spatial division multiplexing in multi-mode fibers or waveguides. Significant research efforts demonstrated numerous realization options, using various fabrication technologies for different settings. Despite this, market impact is small to date. With the data-center driven increasing demand on optical interconnects, fabricable and scaleable solutions are needed. This project will:

  • Evaluate a variety of use cases (e.g. on chip(package), chip to chip, rack to rack etc.), for the applicability and usefulness of a wide and slow approach using SDM.
  • Explore realization and fabrication technologies with a clear focus on fabricable and scaleable solutions, preferentially using only passive photonics.
  • Manufacture well defined functional demonstrators for selected use cases

Expected Results 

  • A clear technological pathway to market for wide and slow optical data transmission based on spatial division multiplexing covering:
    • Well defined, promising use-cases
    • Realization concepts and corresponding
    • Fabrication technologies
  • This will be supported by realizing well defined and validated demonstrators for selected use cases.

 

 

 

Who we are looking for

  • Component provider and Integrator
    • Semiconductor industry (e.g. source/receiver array, PICs, etc.)
    • Optical fiber and fiber cabling technology
    • Other waveguide technologies
    • Special optics providers (e.g. micro-lenses, grin lenses, DOE etc.)
    • PCB technology
    • Etc.
  • Equipment Provider
    • Precision assembly
    • Fiber fabrication
    • Laser processing
    • Precision additive manufacturing technologies
    • Etc.
  • System integrators
    • On Chip
    • Chip to Chip
    • Server to Server
    • Rack to Rack
    • Etc.

Contact

Business Development
Mag. Thomas Ladstätter
Business Development Sensor Systems
Villach

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