Heterogeneous Integration for CPO

Interposer and optical engine are key building blocks for Co-Packaged Optics (CPO). The goal is to develop bonding and integration technologies for low-loss, high-density electrical and optical interconnects. This includes EIC-EIC and EIC-PIC stacking with different bonding strategies, active and passive fiber-to-chip coupling, and the incorporation of emerging materials such as TFLN and polymer waveguides for active interposer functionality. Hybrid bonding is a critical enabler of these integration schemes.

Main challenges:

• Fine-pitch interconnects with minimal electrical and optical losses.
• Thermal management to reduce thermal crosstalk and ensure stable operation.
• High manufacturing yield and reliability for large-scale deployment.