(Senior) Scientist Microsystem Technologies

High Tech Campus Villach, Europastraße 12, 9524 Villach, Austria

In the network of science and industry, the center offers research in four pioneering divisions: Sensor Systems, RF Systems, Power Electronics and System Integration. SAL – a great place to research.

Your future responsibilities

  • R&D on applicative packaging of sensors, actuators & optical components to systems
  • R&D on packaging of power electronic devices
  • R&D on advanced packaging of RF systems
  • Management of projects with industrial collaboration
  • Scientific dissemination
  • Support of national and European funding proposals
  • Responsibility for selected research equipment

Your profile

  • Academic degree (PhD) in microsystems technology, physics or material science preferable with experience in packaging, integration and assembly technologies
  • Advantageous experience in waferbonding technology
  • Advantageous experience in package related multi-physics simulation tools
  • Track record in high impact publications and/or patents
  • Cleanroom experience
  • Academic and industrial network

Important Facts

  • Beginning of the employment: as soon as possible
  • This position is endowed with a gross annual salary of € 46,186 based on the collective agreement for research („Forschungs-Kollektivvertrag“) with express willingness to overpay depending on your experience and skills.