Spatial Thermal Frequency Response Measurement of Power Semiconductor Equipment
High Tech Campus Villach
9524 Villach, Austria
This talk presents spatial thermal frequency response analysis and measurement as a tool enabling maximal density design of power electronic modules and converter systems. It advocates deliberately accounting for dependence of stressful thermal transients, induced by power device losses, on geometric dimensioning and material selection. Next, the paper presents a key evolution to state-of-the-art system identification methods for characterizing transient heat transfer. A proposed measurement setup utilizes infrared thermography to capture spatial temperature gradients resulting from forced, transient loss dissipation. Measurement results are presented in the time domain and, after synthesis, in a compact frequency domain format. Coherent frequency response function measurements quantify the amplitude attenuation and phase delay induced by spatial domain effects, such as component interfacing. Close inspection of results reveal measurement synchronization requirements and how the methodology can be exploited to profile surface topology in prototype assemblies.