Ihr Ansprechpartner

Dipl.-Ing. Dr. Rudolf Heer

Head of Research Unit Electronic Sensors

Telefon: 0664 88 200 197
E-mail: rudolf.heer@silicon-austria.com

Ihr Ansprechpartner

Dr. Michael Ortner

Senior Researcher Microsystem Technologies

Telefon: +43 (0)4242 56300 219
E-mail: michael.ortner@silicon-austria.com

Ihr Ansprechpartner

Lothar Ratschbacher, PhD

Senior Scientist Embedded AI

Telefon: 0664 88 200 214
E-mail: lothar.ratschbacher@silicon-austria.com

Science Talks

Die Science Talks sind fixer Treffpunkt für den Austausch zu wissenschaftlichen Themen. Externe Interessenten und SAL MitarbeiterInnen treffen sich regelmäßig und referieren über neueste Erkenntnisse in ihren Fachbereichen.  Der Zugang zu den Vorträgen ist offen – jeder ist willkommen!

Towards approximating Multiphysics Simulations with Artificial Neural Networks

Monika Stipsitz
Embedded AI
SAL Graz
Inffeldgasse 33
8010 Graz
Dienstag, 24.11.2020

In her Science Talk, Monika Stipsitz is going to talk about "Towards approximating Multiphysics Simulations with Artificial Neural Networks".

A complete analysis of an electronic design requires not only circuit simulations but also the simulation of the thermal and electromagnetic interaction of the different components, packaging, etc. There are several standard methods to perform those simulations but all come at large computational costs, especially for complex systems. In this talk, I will explain how machine learning techniques can be used to approximate these simulation results and, thus, reduce simulation times. As a proof of concept, results for the heat transfer in electronic systems are presented.

Spatial Thermal Frequency Response Measurement of Power Semiconductor Equipment

Timothy Polom
Power Electronics
SAL Villach
High Tech Campus Villach
Europastraße 12
9524 Villach, Austria
Dienstag, 08.09.2020

In his Science Talk, Timothy Polom (Power Electronics) is going to talk about “Spatial Thermal Frequency Response Measurement of Power Semiconductor Equipment”.

This talk presents spatial thermal frequency response analysis and measurement as a tool enabling maximal density design of power electronic modules and converter systems. It advocates deliberately accounting for dependence of stressful thermal transients, induced by power device losses, on geometric dimensioning and material selection. Next, the paper presents a key evolution to state-of-the-art system identification methods for characterizing transient heat transfer. A proposed measurement setup utilizes infrared thermography to capture spatial temperature gradients resulting from forced, transient loss dissipation. Measurement results are presented in the time domain and, after synthesis, in a compact frequency domain format. Coherent frequency response function measurements quantify the amplitude attenuation and phase delay induced by spatial domain effects, such as component interfacing. Close inspection of results reveal measurement synchronization requirements and how the methodology can be exploited to profile surface topology in prototype assemblies.