DIEMAND SIMULATION AND CHARACTERISATION OF DIE BOND PROCESS

Partner Call open until: end of October 2020

Start of the project: Q4 2020

Objectives

The aim of the project is to study die bond processes and material stack-up to

  • Reduce temperature induced stress
  • Increase process stability

The main chal­lenges and topics of inves­ti­ga­tion are:

  • Characterisation of chip bow
  • Material characterization of stack-up for reliable models
  • FEM Model and understanding of main thermo-mechanical processes
  • Mitigate bonding-induced stresses to the delicate devices

Expected Results

  • Verified material models
  • Verified thermo-mechanical processes
  • Design optimization of material stack-up towards minimal thermo-mechanical stress and minimal chip bow