CAPSENS WAFER LEVEL HERMETIC CAPPING FOR MEMS SENSING

Partner Call open until: end of November 2020

Start of the project: Q4 2020

Objectives

The aim of the project is to create a reliable hermetic wafer-level packaging for MEMS sensors in order to

  • Increase the life-time of the sensors in consumer / automotive applications
  • Further reduce the cost and foot-print of the sensors
  • Facilitate the development of novel sensors in wafer-level 

The main chal­lenges and topics of inves­ti­ga­tion are:

  • The selection of bonding and sealing technologies to work under different environmental atmospheres
  • To assess the hermeticity of the sensor upon accelerated life testing
  • The optimized design of cap silicon wafer, device wafer and bottom wafer
  • To mitigate bonding-induced stresses to the delicate sensing devices

Expected Results

  • Enhanced wafer-level hermetic capping technology for MEMS sensors
  • Design optimization of cap wafers for MEMS sensors in terms of topology, sealing materials and technologies
  • Identify the life-time of the sealed sensors