MICROFABRICATION
RF/DC sputtering and e-beam evaporation
- Manufacturer: Leybold
- Model: UNIVEX900

General Description:
The UNIVEX900 is an advanced coating system which can perform co-sputtering and e-beam evaporation in the same chamber in the same chamber. This tool is compatible with 8-inch wafers (200 mm) and can be used to deposit many materials such as metals, oxides or nitrides.
Key Specifications:
- Sputtering
- Max. thickness 3 µm
- RF and DC sputtering
- Co-sputtering possible
- Reactive sputtering with O2 and/or N2
- Conformal coatings
- Target size 4’’
- Max. temperature substrate 400 ͦC
- Materials: SiO2, Si dopped, Al, Mo, AlN, Cu, Ag, Ti, Cr, Ni, PZT, Si (undoped), SixNy, Ta2O5, Al2O3, SiC,…
- E-beam evaporation
- Max. thickness 400 nm
- High deposition rate
- Lowest pressure achievable ~10-7 mbar
- Materials: Ag, Al, Au, Cr, Pt, Ti, Ni
Availability | Use allowed for all researchers with permission |
Location | Cleanroom C5 |
Responsibles / Contact | Dr Adrien PIOT / Dr. Vladimir Pashchenko |