RF/DC sputtering and e-beam evaporation

General Description:

The UNIVEX900 is an advanced coating system which can perform co-sputtering and e-beam evaporation in the same chamber in the same chamber. This tool is compatible with 8-inch wafers (200 mm) and can be used to deposit many materials such as metals, oxides or nitrides.

Key Specifications:

• Sputtering
  • Max. thickness 3 µm
  • RF and DC sputtering
  • Co-sputtering possible
  • Reactive sputtering with O2 and/or N2
  • Conformal coatings
  • Target size 4’’
  • Max. temperature substrate 400  ͦC
  • Materials: SiO2, Si dopped, Al, Mo, AlN, Cu, Ag, Ti, Cr, Ni, PZT, Si (undoped), SixNy, Ta2O5, Al2O3, SiC,…

• E-beam evaporation
  • Max. thickness 400 nm
  • High deposition rate
  • Lowest pressure achievable ~10-7 mbar
  • Materials: Ag, Al, Au, Cr, Pt, Ti, Ni