Manual Wire Bonder

General Description:

With the manual wire bonder, contacts can be established between chip bond pads and adjacent contact pads, e.g. from a housing in which the chip has been placed or from a printed circuit board on which the chip has been fixed onto. The machine can be equipped with different bonding wires like aluminum, gold or platinum.

Key Specifications:

• Default bonding wire: 25μm Aluminum
• Bondhead linear Z travel: 60mm
• Manipulator in X and Y: 18x18mm
• Various mounting options for sample holder. Usually with mechanical clamping or vacuum
• Substrate Size: up to 4 inch
• Heated chuck allows for bonding procedures at elevated temperatures