PACKAGING & ASSEMBLY
Manual Wire Bonder
- Manufacturer: Kulike & Soffa
- Model: K&S 4526

General Description:
With the manual wire bonder, contacts can be established between chip bond pads and adjacent contact pads, e.g. from a housing in which the chip has been placed or from a printed circuit board on which the chip has been fixed onto. The machine can be equipped with different bonding wires like aluminum, gold or platinum.
Key Specifications:
- Default bonding wire: 25μm Aluminum
- Bondhead linear Z travel: 60mm
- Manipulator in X and Y: 18x18mm
- Various mounting options for sample holder. Usually with mechanical clamping or vacuum
- Substrate Size: up to 4 inch
- Heated chuck allows for bonding procedures at elevated temperatures
Availability | Use allowed for all researchers with permission |
Location | Cleanroom C8 |
Responsibles / Contact | Dr. Jochen Bardong / Dr. Ali Roshanghias |