Direct Writing Laser

  • Model: DWL66+

General Description:

The Heidelberg DWL 66+ direct writing laser is a single wafer high resolution pattern writing equipment. Direct writing enables a high versatility and constant optimization of pattern designs. The system is equipped with a 375 nm UV laser for i-line photoresists and SU8 patterning and can achieve a minimum feature of 800 nm. Moreover, the greyscale lithography capability makes the equipment really useful in micro-optics, MEMS and MOEMS applications.


Key Specifications:

  • 375 nm, 70 mW laser source, 10 mm write head
  • High resolution printing down to 800 nm
  • Alignment accuracy up to 150 nm
  • Back side or Front Side alignment
  • Substrate size up to 200 mm diameter
  • Substrate thickness up the 12 mm


Use allowed for all researchers with permission


Cleanroom C5
Europastraße 12
9524 Villach

Responsibles / Contact

Dr. Sarah Risquez / Dr. Vladimir Pashchenko
Tel.:+43 4242 56300 275
Tel.:+43 4242 56300 239