MICROFABRICATION
Direct Writing Laser
- Manufacturer: HEIDELBERG INSTRUMENTS
- Model: DWL66+

General Description:
The Heidelberg DWL 66+ direct writing laser is a single wafer high resolution pattern writing equipment. Direct writing enables a high versatility and constant optimization of pattern designs. The system is equipped with a 375 nm UV laser for i-line photoresists and SU8 patterning and can achieve a minimum feature of 800 nm. Moreover, the greyscale lithography capability makes the equipment really useful in micro-optics, MEMS and MOEMS applications.
Key Specifications:
- 375 nm, 70 mW laser source, 10 mm write head
- High resolution printing down to 800 nm
- Alignment accuracy up to 150 nm
- Back side or Front Side alignment
- Substrate size up to 200 mm diameter
- Substrate thickness up the 12 mm
Availability | Use allowed for all researchers with permission |
Location | Cleanroom C5 |
Responsibles / Contact | Dr. Sarah Risquez / Dr. Vladimir Pashchenko |