Direct Writing Laser

General Description:

The Heidelberg DWL 66+ direct writing laser is a single wafer high resolution pattern writing equipment. Direct writing enables a high versatility and constant optimization of pattern designs. The system is equipped with a 375 nm UV laser for i-line photoresists and SU8 patterning and can achieve a minimum feature of 800 nm. Moreover, the greyscale lithography capability makes the equipment really useful in micro-optics, MEMS and MOEMS applications.

Key Specifications:

• 375 nm, 70 mW laser source, 10 mm write head
• High resolution printing down to 800 nm
• Alignment accuracy up to 150 nm
• Back side or Front Side alignment
• Substrate size up to 200 mm diameter
• Substrate thickness up the 12 mm