PACKAGING & ASSEMBLY

Die Bonder

  • Manufacturer: finetech
  • Model: FINEPLACER lambda

General Description:

The FINEPLACER lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications.

The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. It is the ideal choice for low volume production, prototyping, education and R&D where process flexibility is the key.

 

Key Specifications:

  • Sub- micron placement accuracy
  • Handles ultra-small components, special tools allow object sizes > 5 µm
  • Supported substrate size up to 6"
  • Small footprint and compact design

Availability

Use allowed for all researchers with permission

Location

Cleanroom
Europastraße 12
9524 Villach

Responsibles / Contact

Dr. Ali Roshanghias / Dr. Jochen Bardong
Tel.:+43 4242 56300 256