Spin process simulation
For a major supplier to the semiconductor industry of devices for wet etching wafer surfaces. Both the spin process technology for individual wafers developed by the major supplier and the devices for treating wafer stacks form the basis of a wide product range for etching and cleaning wafers.
CTR supports the development of the above devices with numerical simulation of fluid dynamic processes. These include: 3D simulation of fluid dynamic processes in devices for wet etching 300 mm wafers, simulation of multi-phase flow with free surfaces, simulation of linked liquid transport and heat transmission, and simulation of air flow in clean rooms.
- Photographs with high-speed camera
- CFD simulation
- Interpretation of the simulation and visualisation results by experts in the field of fluid dynamics
- Results for optimising the device geometry
- Name: Spin-process simulation
- Partner: n/a
- Duration: 24 months
Support in further product developments for etching and cleaning wafers.