Advanced Wafer Level Technologies for automotive MEMS sensors

  • Start: Q2 2019


To create a powerful model­ling and MEMS (MEMS = microelectromecha­nical systems) design toolbox for advanced wafer level MEMS inte­gra­tion in order to improve:

  • Next gener­a­tion of Tire-Pres­sure Moni­toring System (TPMS) sensors
  • Inno­v­a­tive design and micro­fab­ri­ca­tion tech­nolo­gies of MEMS devices
  • Wafer level inte­gra­tion process

Photo: © Infineon Technologies Austria AG

The main chal­lenges and topics of inves­ti­ga­tion are:

  • Modelling the influence of anodic bonding process on Tire-Pressure Monitoring System
  • Modelling the charge distribution in and on the structured glass wafer
  • Modelling sensitivity of electrical charges on piezo-resistive accelerometer MEMS structures
  • Predict influence of wafer level MEMS technologies on any future TPMS design

Expected results

  • Predict influence of wafer level technologies on TPMS sensors
  • Influence of anodic bonding process on  TPMS MEMS next generation design
  • Advanced simulation tool for wafer level MEMS integration
  • Improvement of wafer level process technologies