- To establish processes for TSV fabrication, protection, integration, and handling
- To propose via filling approaches after TSV processing
- To adapt temporary bonding technologies for high-yield TSV handling
TSV INTEGRATION TECHNOLOGIES
Partner Call open until: January 11, 2023
Start of the project: Q1 2023
2.5 & 3D integration using through-silicon via (TSV) wafers has attracted much attention in recent years for both front-end foundries and back-end packaging. In this project, SAL & suitable partner(s) will focus on the development of TSV wafer integration processes such as temporary bonding, via filling, thinning and debonding – specifically tailored for advanced sensor/sensing solutions. The selection of bonding and filling technologies as well as materials compatible with the TSV processing temperature is a part of this project. The assessment will cover simulation, wafer processing in cleanroom environment as well as reliability analysis.
Expected results
- Enhancement of TSV integration technologies
- Established TSV filing processes
- Temporary bonding & debonding materials & processes for TSV
