PROGRAM 3

Heterogeneous ‘More-than-Moore’ integration and new types of build and connection concepts

The focus here is the heterogeneous integration of separately-manufactured electronic components into a higher-level assembly. In addition to CMOS scaling in accordance with Moore’s law, heterogeneous integration technologies are a key factor for the miniaturization and improvement of the functional scope of electronic-based systems (EBS).

The objective is to investigate very robust and powerful building and connection technologies in order to enable a “mix and match” of materials and manufacturing that is optimized in term of costs and function, and to ultimately integrate EBS into every device, every machine and every wearable device. The results are expected to offer a competitive advantage for application-orientated EBS companies (including SMEs) that are active in the Industry 4.0.

WHY BECOME A PARTNER IN SAL RESEARCH PROJECTS?

Silicon Austria Labs is one of the most exciting research initiatives in Europe. Researching together with SAL means close cooperation along the added-value chain to work on complex problems and research questions relevant to the future. The joint research results will be able to be implemented for the companies (including SMEs).

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