PACKAGING & ASSEMBLY
Die Bonder
- Manufacturer: finetech
- Model: FINEPLACER lambda

General Description:
The FINEPLACER lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications.
The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. It is the ideal choice for low volume production, prototyping, education and R&D where process flexibility is the key.
Key Specifications:
- Sub- micron placement accuracy
- Handles ultra-small components, special tools allow object sizes > 5 µm
- Supported substrate size up to 6"
- Small footprint and compact design
Availability | Use allowed for all researchers with permission |
Location | Cleanroom |
Responsibles / Contact | Dr. Ali Roshanghias / Dr. Jochen Bardong |