Die Bonder

General Description:

The FINEPLACER lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications.

The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. It is the ideal choice for low volume production, prototyping, education and R&D where process flexibility is the key.

Key Specifications:

• Sub- micron placement accuracy
• Handles ultra-small components, special tools allow object sizes > 5 µm
• Supported substrate size up to 6"
• Small footprint and compact design