Chamber Oven

General Description:

The High Temperature Chamber Oven is designed for thermal processing of small to medium large samples up to 1600 °C. The chamber can achieve fast heating rates (up to 30 °C/min) and allows working under controllable atmosphere using an automatic gas-flow controller.

Key Specifications:

• Maximal T:                                         1600 °C
• Heating elements:                             SiC
• Chamber dimensions:                       120 x 210 x 120 mm
• Maximal heating range:                     30 °C/min
• Controlled atmosphere:                     automatic gassing system; calibration for N2
• Digital PID-temperature control