PACKAGING & ASSEMBLY
Chamber Oven
(High temperature sintering with temperature profiling)
- Manufacturer: Nabertherm
- Model: HTCT 03/16

General Description:
The High Temperature Chamber Oven is designed for thermal processing of small to medium large samples up to 1600 °C. The chamber can achieve fast heating rates (up to 30 °C/min) and allows working under controllable atmosphere using an automatic gas-flow controller.
Key Specifications:
- Maximal T: 1600 °C
- Heating elements: SiC
- Chamber dimensions: 120 x 210 x 120 mm
- Maximal heating range: 30 °C/min
- Controlled atmosphere: automatic gassing system; calibration for N2
- Digital PID-temperature control
Availability | Use allowed for all researchers with permission |
Location | Environmental Lab |
Responsibles / Contact | Dr. Jochen Bardong |