Microsystem Technologies

Advanced Packaging & System Integration
Sensor Systems
High Tech Campus Villach, Europastraße 12, 9524 Villach, Austria

In the network of science and industry, the center offers research in four pioneering divisions: Sensor Systems, RF Systems, Power Electronics and System Integration.
SAL – a great place to research.

Your future responsibilities

  • R&D on Heterogeneous Integration of sensors, actuators & optical components
  • Packaging & integration of power devices
  • Applied research in (funded) projects
  • Simulation & design of prototypes
  • Qualification & verification of prototypes
  • Acquisition & project management of/for projects
  • Scientific dissemination

Your profile

  • YOU are eager to participate in multinational and interdisciplinary research projects and cooperate with international academic and industrial researchers
  • YOU prefer working in a cooperative organized team with an innovative corporate culture and short decision-making processes
  • YOU appreciate an affordable and healthy living environment – full of mountains, lakes and global leading companies in microelectronics
  • YOU are interested in More-than-Moore – challenging the integration of micro-electronics, and optical components towards smart sensors
  • YOU like problem solving especially in the field of innovative system and sensor integration technologies
  • YOU have an academic degree in microsystems technology, physics or material science preferable with experience in packaging, integration and assembly technologies

Important facts

  • Beginning of the employment: as soon as possible
  • This position is endowed with a gross annual salary of € 42,742 based on the collective agreement for research („Forschungs-Kollektivvertrag“) and depending on your experience and skills.


The top re­search center for elec­tronic based systems (EBS).

Unfold the future, unfold your­self.