System Integration

Combine diverse technologies

The re­search area System Inte­gra­tion Tech­nolo­gies deals with the hard­ware part of system inte­gra­tion. In order to connect the indi­vidual compo­nents of an elec­tronic system with each other, hetero­ge­neous inte­gra­tion tech­nolo­gies, exten­sive knowl­edge of elec­tro­magnet compat­i­bility testing and multi­phys­ical system simu­la­tion are required. 

MAIN AREAS OF RESEARCH

 

  • Intelligent system integration technologies to further develop individual components to complete systems
  • Novel modeling approaches and methods in the field of electromagnetic compatibility and coexistence for the smooth interaction of sensitive electronic subsystems and strong interference-causing assemblies
  • System-in-package approaches for miniaturized systems with very high integration density and reliability
  • Connection of flexible electronics on paper or polymer substrates with discrete electronic assemblies to smart sensors
  • New, more miniaturized approaches in 3D and heterogeneous designs for the integration of electronic subsystems or intelligent sensors and actuators in e.g. vehicles, robots, products or machines
  • Optimization of material and microsystem process technology for highly innovative integration solutions

RESEARCH COMPETENCIES

 

  • Heterogeneous integration and packaging technology
  • Multi-physical system simulation and "Hardware in the Loop"
  • Simulation and testing of electromagnetic compatibility & coexistence (EMCC) during all development phases
  • Reliability tests of electronic based systems (SW & HW)
  • Models for a “digital twin” for development and optimization cycles of EBS
  • Virtual prototyping and model-based design