The research area System Integration Technologies deals with the hardware part of system integration. In order to connect the individual components of an electronic system with each other, heterogeneous integration technologies, extensive knowledge of electromagnet compatibility testing and multiphysical system simulation are required.
MAIN AREAS OF RESEARCH
- Intelligent system integration technologies to further develop individual components to complete systems
- Novel modeling approaches and methods in the field of electromagnetic compatibility and coexistence for the smooth interaction of sensitive electronic subsystems and strong interference-causing assemblies
- System-in-package approaches for miniaturized systems with very high integration density and reliability
- Connection of flexible electronics on paper or polymer substrates with discrete electronic assemblies to smart sensors
- New, more miniaturized approaches in 3D and heterogeneous designs for the integration of electronic subsystems or intelligent sensors and actuators in e.g. vehicles, robots, products or machines
- Optimization of material and microsystem process technology for highly innovative integration solutions
- Heterogeneous integration and packaging technology
- Multi-physical system simulation and "Hardware in the Loop"
- Simulation and testing of electromagnetic compatibility & coexistence (EMCC) during all development phases
- Reliability tests of electronic based systems (SW & HW)
- Models for a “digital twin” for development and optimization cycles of EBS
- Virtual prototyping and model-based design